Japan has developed key technologies for semiconductor "core particle" integration
12/16/2022 2:32:44 PM
According to the Nikkei Chinese website, research teams such as Tokyo University of Technology and AOI Electronics have developed key technologies to connect multiple semiconductor chips with different functions and make them work like one chip. This technology can improve the integrated density and electrical characteristics of the chip, and improve the yield.
It is reported that in the past, the connection between cores and particles mostly used the intermediate substrate called "interposer". The mainstream of intermediate layer is silicon substrate, but this substrate has problems in electrical characteristics, positioning accuracy, cost, etc.
The technical advantage of this time is that the connection between core particles or between core particles and the outside can be realized with the minimum elements. It can easily increase the integrated density of the core particles, or improve the electrical characteristics, and it is easy to locate the connection. Another advantage is that it can improve the high-frequency characteristics and heat dissipation performance of the wiring that makes the core particles electrically connected with the outside.
At present, with the evolution of the chip manufacturing process, due to the higher difficulty of design and implementation, and the more complex process, the cost of chip full process design has increased significantly, and the "Moore's Law" is slowing down.
In this context, chiplets (pellets or microchips) are expected by the industry, or they will continue the "economic benefits" of Moore's Law from another dimension. There is an industry view that Chiplet can greatly improve the yield of large chips; It is beneficial to reduce the complexity and cost of design; It is expected to reduce the cost of chip manufacturing.
In March this year, semiconductor manufacturers such as AMD, Arm, ASE, Intel, Qualcomm, Samsung and TSMC, as well as more than ten technology industry giants such as Google Cloud, Meta and Microsoft, jointly established the Universal Small Chip Interconnection (UCIe Chiplet design and other leading manufacturers in various fields.